| Package Accepted | HTSSOP, VFBGA, XFBGA | |
| Number of Positions | 24 | |
| Kit Type | Adapter, Breakout Boards | |
| ECCN | EAR99 | |
| Quantity | 18 Pieces (3 Values - 6 Each) | |
| Product Status | Active | |
| Series | - | |
| Specifications | SMD to DIP | |
| REACH Status | REACH Unaffected | |
| Mfr | NXP USA Inc. | |
| HTSUS | 8534.00.0070 | |
| Package | Bulk | |
| RoHS Status | ROHS3 Compliant | |
| Base Product Number | OM13497 | |
| Moisture Sensitivity Level (MSL) | Not Applicable |
