| Package Accepted | QSOP, TSSOP28, XFBGA, XQFN | |
| Number of Positions | 16, 28 | |
| Kit Type | Adapter, Breakout Boards | |
| ECCN | EAR99 | |
| Quantity | 23 Pieces (4 Values - Mixed Quantities) | |
| Product Status | Active | |
| Series | - | |
| Specifications | SMD to DIP | |
| REACH Status | REACH Unaffected | |
| Mfr | NXP USA Inc. | |
| HTSUS | 8534.00.0040 | |
| Package | Bulk | |
| RoHS Status | ROHS3 Compliant | |
| Base Product Number | OM13496 | |
| Moisture Sensitivity Level (MSL) | Not Applicable |
