| Shape | Rectangular | |
| S/N Ratio | 67dB | |
| Output Type | Digital, PDM | |
| ECCN | EAR99 | |
| Grade | Automotive | |
| Termination | Solder Pads | |
| Current - Supply | 980 µA | |
| Size / Dimension | - | |
| Direction | Noise Cancelling | |
| Height (Max) | - | |
| Voltage Range | 1.62 V ~ 3.6 V | |
| Product Status | Obsolete | |
| Ratings | - | |
| Series | XENSIV™ | |
| Type | MEMS (Silicon) | |
| Sensitivity | -36dB | |
| Qualification | AEC-Q103 | |
| REACH Status | REACH Unaffected | |
| Mfr | Infineon Technologies | |
| HTSUS | 8518.10.8030 | |
| Package | Tape & Reel (TR) | |
| Port Location | Bottom | |
| RoHS Status | ROHS3 Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
