| Housing Material | Polyethersulfone (PES), Glass Filled | |
| Current Rating (Amps) | 1 A | |
| Contact Finish Thickness - Mating | - | |
| Material Flammability Rating | UL94 V-0 | |
| Product Status | Active | |
| Pitch - Post | - | |
| Mfr | 3M | |
| Features | Closed Frame | |
| Pitch - Mating | - | |
| Contact Resistance | - | |
| RoHS Status | ROHS3 Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Contact Finish - Mating | Gold | |
| Operating Temperature | -55°C ~ 150°C | |
| Contact Material - Post | Beryllium Copper | |
| ECCN | EAR99 | |
| Termination | Solder | |
| Mounting Type | Through Hole | |
| Number of Positions or Pins (Grid) | 16 (2 x 8) | |
| Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
| Series | Textool™ | |
| Type | SOIC | |
| Contact Finish - Post | Gold | |
| Termination Post Length | 0.140" (3.56mm) | |
| Contact Material - Mating | Beryllium Copper | |
| HTSUS | 8536.69.4040 | |
| Package | Bulk | |
| Base Product Number | 216 | |
