| Housing Material | Polyethersulfone (PES), Glass Filled | |
| Current Rating (Amps) | 1 A | |
| Contact Finish Thickness - Mating | 200.0µin (5.08µm) | |
| Material Flammability Rating | UL94 V-0 | |
| Product Status | Obsolete | |
| Pitch - Post | - | |
| Mfr | 3M | |
| Features | Open Frame | |
| Pitch - Mating | - | |
| Contact Resistance | 25mOhm | |
| RoHS Status | Not applicable | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Contact Finish - Mating | Tin-Lead | |
| Operating Temperature | 0°C ~ 105°C | |
| Contact Material - Post | Beryllium Copper | |
| ECCN | EAR99 | |
| Termination | Solder | |
| Mounting Type | Through Hole | |
| Number of Positions or Pins (Grid) | 100 (4 x 25) | |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) | |
| Series | OEM | |
| Type | QFP | |
| Contact Finish - Post | Tin-Lead | |
| Termination Post Length | 0.020" (0.50mm) | |
| Contact Material - Mating | Beryllium Copper | |
| HTSUS | 8536.69.4040 | |
| Package | Bulk | |
